
HTR3316
2.5V~5.5V电源供电。16个IO端口中的任何一个都可以配置为LED模式或GPIO模式。
2.5V~5.5V共电共电。16个IO端口号中的很多其中一个都可能能以配资为LED模式,英文或GPIO模式,英文。于此,很多GPIO都可能能以设定配资为输人或伤害。通电后,16个IO服务器网络端口系统配值默认要求设置为GPIO輸出,默认要求设置的情况按照AD0和AD1决策。那些系统配值为输人的IO服务器网络端口都在不间断风控的情况不同,并有着8μs的防会抖精力,IO口的不同由INTN輸出指的是。当GPIO的情况实现I2C插孔被读取硬盘时,INTN輸出被清空。当IO端口设施设备为LED模式英文时,能根据I2C主板接口将LED驱程器的电流量值设施在0~IMAX之中,并能以该值除了256步进电机调节行波形调光。默许很大电流量值(IMAX)为37mA,可在整体在调节寄存器中调整IMAX。HTR3316提供QFN4×4-24L封装。
价格:¥0.00 | 库存99999 |
人数:
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作用
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引脚号 | 名字大全 | 特点 |
1~4 | P1_0~P1_3 | GPIO mode default, input or output (push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.锁定GPIO形式 ,键入或打出(推挽成分),上电锁定的情形由AD1和AD0而定。可放置为LED形式 。 |
5~8 | P0_0~P0_3 | GPIO mode default, input or output (open-drain (default) or push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.初始GPIO机制,进入或效果(开漏设计(初始)或推挽设计),上电初始情况下由AD1和AD0影响。可装置为LED机制。 |
9 | GND | Ground. 地 |
10~13 | P0_4~P0_7 | GPIO mode default, input or output (open-drain (default) or push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.同意GPIO,效果或效果(开漏设备构造(同意)或推挽设备构造),上电同意的情形由AD1和AD0取决于。可设为为LED状态。 |
14~17 | P1_4~P1_7 | GPIO mode default, input or output (push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.同意值GPIO,輸入或模拟输出(推挽结构类型), ,上电同意值感觉由AD1和AD0来决定。可快速设置为LED格局。 |
18 | AD0 | I2C device address, connect to VCC or GND,and control the defaulꩵt state of GPI🐽Os (see table 1)。 I2C器件地址选择,接VCC或GND,并设置GPIO状态(见表1)。 |
19 | SCL | I2C serial clock. I2C时钟 |
20 | SDA | I2C serial data. I2C数据 |
21 | VCC | Power supply. 电源线手机输入端. |
22 | INTN | Interrupt output pin, open-drain, need external pull-up resistor; active low.出现中断打出,开漏设计,需表面上拉功率电阻;低合理有效 |
23 | RSTN | Hardware reset pin, active low; internal 100 kΩ (typical) pull-down resistor.电脑硬件恢复,低为恢复;内部属拉100 kΩ(关键值)电阻器 |
24 | AD1 | I2C device address, connect to VCC or GND,and control ♑the default state of GPIO (see table⛎ 1)。 I2C器件地址选择,接VCC或GND,并设置GPIO状态(见表1)。 |
EP | GND | Provides both electrical and thermal connection from the device to the board. Connect to the system ground. 接地极。 |