HTR3316
2.5V~5.5V电源供电。16个IO端口中的任何一个都可以配置为LED模式或GPIO模式。
2.5V~5.5V24v电源供电设备。16个IO服务器端口中的某些一两个都在以手机硬件配置为LED方式或GPIO方式。与此同时,某些GPIO都在以单单手机硬件配置为输进或转换。通电后,16个IO服务器网口配值默许为GPIO效果,默许的情况依照AD0和AD1绝对。一切配值为载入的IO服务器网口都要坚持监控录像的情况改变,并更具8μs的防颤动时刻,IO口的改变由INTN效果提示。当GPIO的情况依据I2Cusb接口被载入时,INTN效果被移除。当IO表层設置为LED模型时,就会在I2C接头将LEDwin7伺服驱动器的感应电流值設置在0~IMAX直接,并就会以该值剩以256步进电机操控行线形调光。默认要求最大程度感应电流值(IMAX)为37mA,可在缺省在操控寄存器中变更IMAX。HTR3316提供QFN4×4-24L封装。
价格:¥0.00 | 库存99999 |
用量:
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特性
| 软件
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引脚号 | 种类 | 技能 |
1~4 | P1_0~P1_3 | GPIO mode default, input or output (push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.自定义要求GPIO方法,发送或输出的(推挽结构特征),上电自定义要求的状态由AD1和AD0取决。可软件设置为LED方法。 |
5~8 | P0_0~P0_3 | GPIO mode default, input or output (open-drain (default) or push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.默许GPIO模试,导入或效果(开漏架构(默许)或推挽架构),上电默许睡眠状态由AD1和AD0关键。可快速设置为LED模试。 |
9 | GND | Ground. 地 |
10~13 | P0_4~P0_7 | GPIO mode default, input or output (open-drain (default) or push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.默许要求GPIO,导入或工作输出(开漏构成(默许要求)或推挽构成),上电默许要求方式由AD1和AD0选择。可安装为LED摸式。 |
14~17 | P1_4~P1_7 | GPIO mode default, input or output (push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.如何设置GPIO,搜索或打印输出(推挽结构的), ,上电如何设置的状态由AD1和AD0定。可如何设置为LED的模式。 |
18 | AD0 | I2ဣC device address, connect to VCC or GND,and control the default state of GPIOs (see table 1)。 I2C器件地址选择,接VCC或GND,并设置GPIO状态(见表1)。 |
19 | SCL | I2C serial clock. I2C时钟 |
20 | SDA | I2C serial data. I2C数据 |
21 | VCC | Power supply. 供电键入端. |
22 | INTN | Interrupt output pin, open-drain, need external pull-up resistor; active low.终止输入,开漏组成部分,需表面上拉电阻值;低合理有效 |
23 | RSTN | Hardware reset pin, active low; internal 100 kΩ (typical) pull-down resistor.硬件配置恢复,低为恢复;内下级拉100 kΩ(典型示范值)热敏电阻 |
24 | AD1 | I2𝕴C device address, connect to VCC or GND,and control the default state of GPIO (see table 1)。 I2C器件地址选择,接VCC或GND,并设置GPIO状态(见表1)。 |
EP | GND | Provides both electrical and thermal connection from the device to the board. Connect to the system ground. 接地装置。 |